The PCB market remains under clear pressure as we move through the second half of 2026.

While the broad market is more stable than in earlier disruption periods, pricing and supply conditions are still far from normal. Instead of universal shortages, the current pressure is concentrated in CCL, prepreg, copper foil, glass fiber, chemicals, and selected high-performance PCB materials.

Recent supplier updates show that PCB manufacturers are increasingly focused on allocation, material access, and alternative approvals rather than on routine capacity planning. At the same time, public market sources confirm that PCB prices rose sharply during spring 2026, supported by strong AI server demand and shortages across key raw materials. Copper foil, resin systems, and glass fiber remain among the most important pressure points in the market.

One of the key drivers behind the current situation is the reallocation of upstream capacity toward higher-end products such as AI server boards, HDI, high-layer multilayers, and low-loss materials. This affects not only advanced designs but also standard industrial boards, because traditional material streams are increasingly being absorbed by higher-specification demand. As a result, lead times are becoming less predictable, pricing is more volatile, and material availability is becoming a more important factor than factory output alone.

For the remainder of 2026, the most likely scenario is continued upward pricing pressure, selective material shortages, and tighter quote validity across the PCB market. Customers with critical demand, fixed launch timing, or dependency on specific materials should continue to plan early and stay close to suppliers on forecasts, alternatives, and open orders.